NITI AAYOG RELEASES “FUTURE OF INDIA’S SEMICONDUCTOR INDUSTRY” ROADMAP

NITI Aayog’s 2035 roadmap targets a $120–150 billion semiconductor value chain, aiming to cut India’s 95% import dependence. It outlines a $180 billion investment plan driven by a 5P strategy: Pioneering, Policy, Production, People, and Partnership.

Description

Why In News?

NITI Aayog’s Frontier Tech Hub launches India’s first comprehensive 10-year roadmap to establish a self-reliant semiconductor ecosystem.   

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Highlights of the Future of India’s Semiconductor Industry

The NITI Aayog report "Future of India’s Semiconductor Industry", outlining India's strategic path toward technological sovereignty and a USD 120-150 billion semiconductor value chain by 2035.

Key Economic Targets

 

2024/Current Status

2030 Projection

2035 Projection

Global Market Size

USD 631 Billion

USD 1,029 Billion

USD 1,547 Billion

India Demand

~USD 30 Billion

USD 90 Billion

>USD 200 Billion

India Value Chain Target

Nascent

-

USD 120-150 Billion

Strategic Objectives

Global Leadership: Become a top-three destination for Outsourced Semiconductor Assembly and Test (OSAT) and Advanced Packaging.

Manufacturing Dominance: Secure leadership in mature-node logic, specialty analog, and compound semiconductors (Silicon Carbide - SiC and Gallium Nitride - GaN).

Design Sovereignty: Leverage India’s 20% share of the global semiconductor design workforce to create over 100 advanced semiconductor design IPs.

Material Supply: Emerge as a trusted supplier of wide-bandgap materials and critical semiconductor chemicals.

The Five Strategic Pillars of India's Roadmap

India organizes its national mission around five mutually reinforcing pillars to strengthen the indigenous ecosystem.

Pioneering (R&D and IP)

  • Establish a National Frontier Semiconductor Research Programme.
  • Launch a Strategic Semiconductor IP and Patent Programme to build domestic ownership.
  • Deploy an AI-Enabled Semiconductor Engineering Mission to accelerate design cycles.
  • Provide sovereign access to Electronic Design Automation (EDA) and Multi-Project Wafer (MPW) infrastructure.

Policy and Investment

  • Maintain institutional governance and policy stability to attract long-term capital.
  • Implement a Full Stack Incentive and risk-sharing regime under ISM 2.0.
  • Create a National Semiconductor Capital Framework to mobilize funding for high-capex projects.
  • Drive demand creation through market anchoring in domestic sectors like automotive and telecom.

Production

  • Focus on Wafer Fabrication where India has a structural advantage (mature nodes and specialty chips).
  • Prioritize Advanced Packaging (chiplets, 2.5D/3D integration) as a national differentiator.
  • Secure upstream manufacturing, including materials and substrates.
  • Enable export-oriented production to integrate into global supply chains.

People (Talent Development)

  • Build a National Semiconductor Talent Pyramid to address all levels of the value chain.
  • Develop a Fab-Ready Technician Pipeline to ensure operational reliability of manufacturing plants.
  • Focus on specialized engineering talent for Design, Manufacturing, and Advanced Packaging.
  • Attract global experts through a Global Talent Infusion program.

Partnership

  • Forge Strategic Geopolitical Partnerships with "trusted nations" (US, Japan, EU).
  • Establish Critical Minerals and upstream resource partnerships to secure raw materials.
  • Link academia and industry through Talent and Institutional Partnerships.

The "Semiconductor Imperative": Why India Must Act Now

NITI Aayog identifies four critical drivers for immediate action:

  • Significant Import Dependence: Currently, 90-95% of India’s semiconductor consumption is met through imports.
  • Drain on Forex: India spent nearly USD 150 billion on semiconductor imports between FY17-FY25. Without domestic production, this cost could rise to USD 240 billion annually by 2035.
  • National Security Risk: Reliance on "black-box" foreign technology for UAVs, naval, and airborne platforms poses a threat to strategic autonomy.
  • Societal Upliftment: Domestic chip production lowers the cost of 5G/6G devices, enabling remote healthcare, smart agriculture, and rural connectivity.

ISM 2.0: Deepening the Ecosystem

Announced in the Union Budget 2026-27, India Semiconductor Mission (ISM) 2.0 marks a transition from ecosystem initiation to ecosystem deepening.

  • Priority Shift: Places design as the "clear number one priority."
  • Infrastructure: Focuses on the first fabrication facility at Dholera and new investments in assembly and testing.
  • Strategic Leapfrogging: Directly targets emerging technologies like chiplets, heterogeneous integration, and system-level design to bypass legacy manufacturing hurdles.

Conclusion

India must convert semiconductors from a strategic vulnerability into a source of national strength by establishing itself as an indispensable, top-tier global hub for design, advanced packaging, and specialty manufacturing by 2035.

Source: pib

PRACTICE QUESTION

Q. In the context of the technological components being localized in India's semiconductor push, what is the difference between Intrinsic and Extrinsic semiconductors?

A) Intrinsic semiconductors conduct electricity at absolute zero Kelvin, whereas extrinsic semiconductors only conduct at room temperature.

B) Intrinsic semiconductors are pure chemical elements, while extrinsic semiconductors are doped with impurities to enhance conductivity.

C) Extrinsic semiconductors have an equal number of holes and electrons, while intrinsic semiconductors have an excess of either.

D) Extrinsic semiconductors cannot be used in microprocessors and are exclusively used for solar cells.  

Answer:

Explanation: 

Pure semiconductors (like pure silicon or germanium) are "intrinsic." The process of intentionally adding impurities to change their electrical properties is called "doping," which creates "extrinsic" semiconductors (like p-type or n-type).

Frequently Asked Questions (FAQs)

NITI Aayog's "Future of India's Semiconductor Industry" roadmap aims to build a $120–150 billion domestic semiconductor value chain by 2035.

The roadmap is anchored around five mutually reinforcing pillars: Pioneering (frontier R&D), Policy and Investment, Production, People (talent development), and Partnerships.

ISM 2.0 marks a shift from ecosystem creation to ecosystem deepening, focusing heavily on expanding design capabilities, building advanced packaging (OSAT) units, and developing a deep talent base

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