ISM 2.0

3D GLASS SEMICONDUCTORS EXPLAINED

India’s ₹1,943 crore Odisha unit advances technological sovereignty. Using 3D glass packaging to bypass silicon limits, it pivots India toward high-value manufacturing. Success requires overcoming supply chain gaps and talent deficits.

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India Semiconductor Mission 2.0

India Semiconductor Mission 2.0, announced in Budget 2026–27 with an allocation of ₹1,000 crore, aims to strengthen domestic semiconductor manufacturing, develop indigenous equipment and materials, promote full-stack chip design, and build a skilled workforce. Building on the progress of earlier initiatives, the mission focuses on advanced manufacturing, supply chain resilience, and industry-led innovation. With a rapidly growing domestic market expected to reach $100–110 billion by 2030, ISM 2.0 seeks to reduce import dependence, meet 70–75% of India’s chip demand by 2029, and position the country as a trusted global semiconductor hub.

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